UCIe
Universal Chiplet Interconnect Express — an open industry standard (2022) for how chiplets communicate die-to-die within a package. Goal: an open market where chiplets from different vendors can be combined like components on a circuit board.
Background: today chiplet links (Infinity Fabric, EMIB) are proprietary → you can only mix one vendor's own dies. UCIe (driven by Intel, AMD, Arm, TSMC, Samsung, Google and others under the UCIe Consortium) standardizes the physical layer + protocol so that, say, a TSMC-made accelerator can be paired with another's I/O die. It builds on PCIe/CXL protocols on top. Vision: a "chiplet ecosystem" that lowers cost + time for custom silicon. UCIe 2.0 (2024) added manageability + 3D support. Early stage 2024 — few commercial multi-vendor products yet, but strategically central to the future of semiconductors.