Besi

Besi (BE Semiconductor Industries) was founded in 1995 and sits in Duiven, the Netherlands. It handles what happens after the chip is finished: die attach, bonding and molding — the steps that assemble finished circuits into packages.

Its spearhead is hybrid bonding, where two surfaces are joined directly copper-to-copper without solder bumps, packing the connections tighter than any fan-out method. That is the enabler for the next generation of chiplets and HBM stacks, and Besi develops the machines jointly with Applied Materials. When advanced packaging became the industry's bottleneck, a once-obscure company suddenly turned hot.