Chiplet
CPU/GPU design strategy where the processor is built from several smaller dies (chiplets) on the same package instead of one monolithic die. AMD Zen 2 (2019) popularized the approach; Intel followed with Meteor Lake (2023).
Advantages: better yield (smaller dies → fewer defects per die), the ability to mix processes (compute die in 5 nm, IO die in 12 nm — cheaper overall), modular — the same chiplets in different combinations create different SKUs. Interconnect is critical: AMD Infinity Fabric, Intel EMIB/Foveros. Drawback: package size grows, higher interconnect latency vs monolithic. Nvidia long resisted chiplets for consumer GPUs; H100/B200 datacenter GPUs have gone that way. The whole industry is shifting — monolithic is dying for high-end.