SoC
System on Chip — all major components (CPU, GPU, RAM controller, modem, NPU, IO) on one die. Standard in mobile phones since the 2000s; the Apple M series took the concept to desktop/laptop with great success (M1, 2020).
Advantages: shorter interconnects → lower latency + lower power, higher integration saves space, one chip to produce. Trade-off: no RAM upgrade possible (Apple M Macs have RAM on package), no GPU swaps (integrated), repair = replacing the whole board. Mobile SoCs: Qualcomm Snapdragon, Apple A series, MediaTek Dimensity, Samsung Exynos. Server trend: AMD and Intel are moving toward more-integrated SoC designs (Bergamo, Meteor Lake).